TDK named a Clarivate Analytics Derwent Top 100 Global Innovator 2018-19

TDK Corporation (TSE:6762) has been selected as one of the Derwent Top 100 Global Innovators 2018-19 by Clarivate Analytics (formerly the Intellectual Property and Science business of Thomson Reuters).
This is the fifth time TDK has been named to the prestigious list.

TDK Corporation (TSE:6762) announced that it has been selected as one of the Derwent Top 100 Global Innovators 2018-19 https://clarivate.com/top100innovators by Clarivate Analytics (formerly the Intellectual Property and Science business of Thomson Reuters).
This is the fifth time TDK has been named to the prestigious list.

To determine the world’s most innovative companies, Clarivate Analytics uses a methodology that analyzes four primary criteria: overall patent volume (i.e., a minimum of 100 patents must have been granted over the most recent five-year period), a successful patent-application-to-grant ratio, global patent protection of the portfolio, especially by Chinese, European, Japanese and U.S. patent offices, and the number of citations by other organizations as evidence of patent influence.

Since its inception in 1935, TDK has dedicated itself to continually inventing superior materials, production technologies, and optimal processing techniques. TDK offers a comprehensive product portfolio spanning passive components such as capacitors, inductors and piezo and protection devices, as well as customized products including sensors and energy devices. The company’s electronic solutions are used in a broad spectrum of applications including automotive and industrial electronics, as well as in communications technology and solutions for the Internet of Things (IoT).

TDK will continue to improve its innovative strength by offering solutions that leverage the company’s broad spectrum of technologies.

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Media Contact 
Dachs Electronica, S.A. Contact: info@dachs.es 
Pol. Ind. Els Garrofers
Avda. del Progrés 97 – 08340 Vilassar de Mar
info@dachs.es -Tel. +34 93 741 85 00
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Spring-Finger-TE

TE Connectivity: Spring Fingers with Ultra Small Footprint

INTRODUCING ULTRA SMALL SPRING FINGERS

Our new ultra small spring fingers have one of the smallest footprints in the market to save valuable PCB space, allowing for use in a broad range of applications with space constraints across various industries.

• Space savings

• Superior performance

• Improved assembly efficiency

 

 

Spring Fingers

 

KEY BENEFITS

• Save valuable PCB space with one of the smallest footprints in the market

• Closed-loop contact design ensures reliable connection to the PCB, better normal force and higher current capacity (1.5A)

• Robust side wall minimizes overcompression

• Special anti-lifting design can improve assembly efficiency by locking the tip of the contact within the sidewall of the spring finger, which helps prevent the contact from getting caught on an operator’s glove during assembly

• Pick-and-place area supports auto-assembly processes

• Offered in different heights and styles

 

APPLICATIONS

• Mobile phones

• Wearable devices

• Smart speakers

• Bluetooth earbuds

• VR headsets

• Tablets & laptops

• Infotainment

• Patient monitoring devices

 

ELECTRICAL

• Voltage rating: 10VDC

• Current rating: 1-1.5A

• Contact resistance: 30 – 50mΩ

 

MECHANICAL

• Normal force: 0.4 – 0.7N minimum

 

MATERIALS

• Contacts: Stainless steel

 

STANDARDS & SPECIFICATIONS

• 108-115144 501-115160

• 108-115120 501-115131

 

Marca distribuidora

 

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Soporte técnico y comercial:

Les invitamos a contactar con nuestro personal de DACHS ELECTRÓNICA para recibir todo el soporte técnico y comercial.

Media Contact 
Dachs Electronica, S.A. Contact: info@dachs.es 
Pol. Ind. Els Garrofers
Avda. del Progrés 97 – 08340 Vilassar de Mar
info@dachs.es -Tel. +34 93 741 85 00
BARCELONA – ESPAÑA